Dr. Prabu Raja, President, Semiconductor Products Group

Mr. Brian Tan, Regional President (Southeast Asia)

Distinguished guests,

Ladies and gentlemen,

 

Introduction

 

1. Good afternoon. It is my pleasure to be here today to celebrate the launch of the Equipment and Process Innovation and Commercialisation (or EPIC) Advanced Packaging Platform in Singapore.

 

2. Applied Materials is the world’s largest semiconductor and display manufacturing equipment company, and a key contributor to Singapore’s semiconductor equipment industry.

 

a. From a small sales and service office in 1991, it has grown its presence in Singapore, covering a range of diverse functions including manufacturing, supply chain management, talent development and R&D.

 

i. For example, its Asia Production Centre here is responsible for the final configuration, consolidation, and testing of all wafer fabrication equipment in Asia.

 

ii. Singapore also hosts Applied’s most comprehensive R&D centre outside of the US, employing more than 170 employees across a variety of roles and domains.

 

b. Over the years, Applied has also built up strong partnerships with research institutes in Singapore.

 

i. In 2011, Applied and the A*STAR Institute of Microelectronics (IME) established the Centre of Excellence in Advanced Packaging.

 

ii. Since its inception, the Centre has created more than 120 innovation jobs and benefitted at least 60 industry partners in product development.

 

3. The EPIC Advanced Packaging Platform marks a new phase of the partnership between Applied and A*STAR’s IME.

 

a. The recent boom in generative AI has propelled the importance of advanced packaging as a critical technology enabler to enhance the integration, performance and energy efficiency of AI chips.

 

b. To support AI workloads, the semiconductor industry is also exploring new architectures for next generation memory and logic technology nodes, some of which could include heterogenous integration techniques, such as hybrid bonding.

 

4. Applied’s EPIC Advanced Packaging Platform will enable Singapore to participate in the innovation of new chip architectures, materials and processes. This will benefit not only Applied, but our local industry semiconductor ecosystem.

 

a. Our chipmakers, system and semiconductor companies will get access to next-generation process equipment. This will enable them to accelerate the development and validation of new semiconductor devices and structures.

 

b. This collaboration will also offer opportunities for suppliers to develop capabilities to support globally leading semiconductor players.

 

i. For example, ACE United Technologies and PBA Group are two local companies that have been partnering Applied Materials to develop solutions for advanced packaging.

 

ii. ACE United is a local enterprise specialising in precision machining of semiconductor parts and components, while PBA Group specialises in direct drive motor design and manufacturing, motion control and precision modular assemblies.

 

iii. Both companies will benefit from the innovations that Applied’s EPIC Advanced Packaging Platform can offer.

 

5. Besides supporting the development of our semiconductor industry, this collaboration will also enrich our research ecosystem.

 

a. It will provide an avenue for our researchers to acquire experience, knowledge and capabilities as they engage with globally leading semiconductor players and contribute to foundational research for next-generation tools.

 

i. This will enable them to gain early insights into the requirements of the industry at the product development stage, and help accelerate research and commercialisation.

 

6. By bringing together both industry and research players, this creates a platform for semiconductor manufacturers, system companies, startups, suppliers and universities to co-innovate and develop new materials, architectures and technologies. This is in line with our Research, Innovation and Enterprise 2025 efforts to drive Singapore’s transformation as a knowledge-based, innovation-driven economy.

 

a. For example, we are investing $180 million to establish a National Semiconductor Translation and Innovation Centre (NSTIC), that will provide companies and researchers the necessary infrastructure and support for R&D, prototyping and small-volume manufacturing.

 

b. We have also invested about $100 million to develop the National Gallium Nitride Technology Centre, in order to drive R&D and manufacturing of Gallium Nitride devices and promote collaborations between industry and academia.

 

7. In closing, I thank Applied for its confidence in Singapore, and choosing to anchor its work in advanced packaging in Singapore. This is not only an important milestone for Applied, but also a significant investment that will reinforce Singapore’s position as a research and innovation hub, deepen our R&D capabilities, and benefit our local semiconductor ecosystem.

 

8. I look forward to the success of the EPIC Advanced Packaging Platform and to further deepening our partnership with Applied Materials in the years ahead.